PAMIĘCI NVMePRZYSZŁOŚĆ PAMIĘCI SZYBKIEGO DOSTĘPU

RAFAŁ SŁONIEWSKI

Solutions Manager

W JAKIM KIERUNKU ZMIERZA RYNEK – PRZYSZŁOŚĆ TO SSD

0

5 000

10 000

15 000

20 000

25 000

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2013 2014 2015 2016 2017 2018

PCIe SSD Shipment(PB)SATA/SAS SSD Shipment(PB)

Shipments of PCIe SSD and SATA SSD in ServerSource: Gartner 2015.Q2Shipment�(PB)

SSD replaces SAS HDD, PCIe SSD replaces SATA SSD.

PCIe SSD performance is over 10 times than SATA SSD.

010 00020 00030 00040 00050 00060 00070 00080 00090 000

100 000

SAS HDD Shipment Enterprise SSD Shipment PB

Shipments of Enterprise SSD and SAS HDD in ServerShipment (PB)

800,00

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84,000700 160

PCIe SSDSATA SSD 15Krpm

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IOPS/Watt�Comparison�

NVMe (Non-Volatile Memory Express) standard unifies the driver of different 

vendors’ PCIe SSDs, integrates the driver into OS.

6.5/6.6/6.7/7.0/7.1

SLES�11�SP3SLES�12

13/14

ESXi�6.0vSphere�6.0

NVME DRIVER ECOSYSTEM

PCIe adapter card

RAID card

CPU2

CPU1

PCIe x16

PCIe x8

SAS x4SAS x4

PCIe x4PCIe x4PCIe x4PCIe x4

EXP

HDD0

HDD1

HDD2

HDD3

HDD4

HDD5

HDD6

HDD7

HDD8

HDD9

HDD10

HDD11

12x3.5’ disk backplane

Mini SAS HD lanes

Mini SAS HD lanes

/NVMe SSD

/NVMe SSD

/NVMe SSD

/NVMe SSD

NVMe SSD DISK TOPOLOGIA POŁĄCZEŃ

SCENARIUSZE PRACY: OLTP/OLAP DB, VDI, INDEXING

Step�1:�high�price,�low�capacity• High-end OLTP DB• ISP searching began usingProduct: PCIe SSD card

Step�2:�price�down,�capacity�up• OLTP DB, ISP large-scale use• Data warehousing, VM began usingProduct: PCIe SSD card, SATA SSD disk

Step�3:�lower�price,�larger�capacity• Big data, data warehousing• ISP, OLTP DBProduct: SATA SSD disk, PCIe SSD cardTrends: NVMe PCIe SSD disk/card

Indexing

Data�WarehousingVirtual�Desktop

OLTP�Database

Front-End�Web

40 nm 34 nm 25 nm 19/20 nm 15/16 nm 3DNAND Flash

SCENARIUSZE WYKORZYSTANIA

Database Virtualization CDN Big Data Searching HPCA large number of VDIs boot, produce sudden high concurrency IO, require high IOPS performance.

High concurrency, data volume, target data block is small and discrete, requiring large storage capacity and high IOPS performance.

Hot prominent, high concurrent access, require high read bandwidth and IOPS.

Large amount of data, data discrete, short-term high concurrent access, require low latency, high concurrency, randomness.

Small blocks of high frequency data read and write operations, require low latency and high IOPS.

Short of massive data processing (read and write), require high bandwidth, IOPS high, low latency.

Low access latency, high-throughput (IOPS), high bandwidth, high random access

TECHNOLOGIE WSPIERAJĄCE NVME

NVMControl technologies are the product features set for high-performance and high-reliability, include IOControl and DataControl.

• 3.2 GB/s Bandwidth• 800,000 IOPS• 18µs Latency

• 2,000,000 Hours MTBF• AFR ≤ 0.44%• UBER 10-17

WYDAJNOŚĆ MYSQL OLTP POPRAWIONA 15x

Using two ES3000 V3 to replace the local HDDs, and use LVM mirroring manager to make data redundancy. OLTP performance improved almost 15x Support DRBD + Pacemaker + Corosync to make cluster

Before

RAID 1

OS

RAID 10

Database�files

After

RAID 1

OS

LVM Mirroring

Database�files

RAID 1

LVM�Log

MySQL�OLTP�performance (bigger�is�better)(Transaction Per Second, TPS)

294

4528ES3000 Solution

Local HDDs Solution

Improve 15x

WYDAJNOŚĆ SQL OLTP POPRAWIONA 10x

Using two ES3000 V3 to replace the local HDDs, and use Soft RAID 1 to make data redundancy. OLTP performance improved almost 10x Support AlwaysOn to make cluster

Before

RAID 1

OS

RAID 5

Database�files

After

RAID 1

OS

Soft RAID 1

Database�files

SQL�Server�OLTP�performance (bigger�is�better)(Transaction Per Second, TPS)

644

6204ES3000 Solution

Local HDDs Solution

Improve 10x

BOOT STORM! WIĘCEJ VDI

Adding one ES3000 V3 into VDI server as a cache device. solve the boot storm, boot time 20 seconds, reduces 96%. VDI density from 30 to 50, increase 67%.  Keep the original solution architecture

ES3000 Cache Solution(50 VDIs)

Local HDDsSolution(30 VDIs)

VDI�Boot�Time (smaller�is�better)

Saving 96%

480�s

20�s

VDI�Clients

ES3000�V2VDI�Server

Internet

PEŁNE PORTFOLIO SERWERÓW WSPIERAJĄCYCH DYSKI NVME

RH1288 V3 (4 NVMe SSDs)

XH620 V3 (2 NVMe SSDs)

RH2288H V3 (12 NVMe SSDs)

RH2288H V3 (24 NVMe SSDs)

5288 V3 (4 NVMe SSDs)

RH2288(H) V3 (4 NVMe SSDs)

ES3600P V3 NVMe SSDs

CH121 V3 (2 NVMe SSDs)

CH225 V3 (12 NVMe SSDs)

CH242 V3 (4 NVMe SSDs)RH5885(H) V3 (4 NVMe SSDs)

RH8100 V3 (8 NVMe SSDs)

SHOW ME YOUR NVMe

RHx288RODZINA SERWERÓW RACK

RAFAŁ SŁONIEWSKI

Solution Manager

SMI2

SMI2

QPI

PCIe

PCH

Hard disk

backplane

PCIe

BMC

PCIe expansion

BIOS

Management chipRAID controller card

NC Interconnect chip

Converged I/Ochip

SSD Huawei develop

GDZIE ZACZYNA SIĘ OPTYMALIZCJA?

INNOWACYJNOŚĆ ROZWIĄZAŃ

Engineering innovation

Engineering innovation

Chipinnovation

Chipinnovation

Architectureinnovation

Telecom Internet

DEMTHigh-voltage DCDEMTHigh-voltage DC

Modular serverIndustry's first PCIe

SSD card

Modular serverIndustry's first PCIe

SSD card

Management chip ASIC

SSD controller

Management chip ASIC

SSD controller

Memory hot swapLiquid coolingMemory hot swapLiquid cooling

Fault-tolerant server, hyper-

converged infrastructure

Fault-tolerant server, hyper-

converged infrastructure

Black box, high-temperature running

(55°C)

Black box, high-temperature running

(55°C)

ATCA architectureATCA architecture

x86 midrange computerx86 midrange computer

All industries

Converged I/O chipRAID controller cardConverged I/O chipRAID controller card

CPU hot swap, photonic interconnectCPU hot swap, photonic interconnect

DC3.0Resource decoupling

DC3.0Resource decoupling

VDI appliance and SPARK appliance

SAP HANA appliance, virtualization appliance

Internet application server

Application solution

innovation

RAS - RELIABILITY, AVAILABILITY, AND SERVICEABILITY

Proactive Failure Analysis Engine (PFAE)Forward-looking fault management, reducing the ratio of system crashes and data errors resulting from component faults

Replacement of core parts with zero downtime DIMM failure ratio comes second only to hard disk failure ratio. Replacing core parts with standard RAS features requires a system shutdown. Huawei RAS 2.0 enables hot swap for CPUs and DIMMs.

Modular design for tool-free O&M without opening the chassis cover; 8-inch touchscreen LCD for GUI-based management and efficient O&M

100% modular design for tool-free O&M

Proprietary management chip

BMC/BIOS source code

Full redundancy design

Autonomous chip error correction and tolerance Fault recording

Automatic fault recording and comprehensive collection

Fault analysis, prewarning, and presentation

Online error correction

CPU, DIMM, and NC, etc.Core FRU hot swap

Automatic isolation, FRU replacement

Hardware Layer

Firmware Layer

OS Layer Maximum fault avoidance

Minimal impact on functions in case of

faults

Quickest possible replacement

if functions are affected

Capable of +99.999% reliability

The 2-socket rack servers provides up to 27 RAS enhanced technologies for high-reliability applications, improving the system reliability.

CPU kernel isolationCPU power detection

Mem

ory

CPU CPU

Mem

oryM

emory

Mem

ory

Mem

oryM

emory

Mem

oryM

emory

PCIe devicePCIe fault reportMemory check, automatic inspectionSingle-granularity data checkMemory mirroringMemory backupMemory address parity check

No. Type RAS Feature1

System architecture

System error records2 Fault diagnosis

3Fault tolerant management framework combining software and hardware (eMCA2)

4 Isolation of faulty components5 PFA fault precaution6 Enhanced SMM (eSMM)

7

OS

Isolation of memory pages, memory blocks, and DIMMs

8 Online service migration9 Online OS upgrade

10 Multiple copies of key codes11

Memory

Memory check and automatic inspection12 Failed DIMM identification and isolation13 Single Device Data Correction (SDDC)14 Memory temperature adjustment

15 Device Tagging (replacement of the faulty granule)

16 Memory redundancy (Memory MultiRank Sparing)

17 Memory mirroring (Mirroring)

18Memory address parity protection (DDR4 Address & Command Parity Retry)

19Data Scrambling (the data transmission performs pseudo random scrambling, to achieve distribution of 0s and 1s)

20

CPU

Kernel isolation configuration21 Socket isolation

22 The out-of-band system accesses MCA registers by using the PECI

23 IVR (core/socket voltage check)

Memory isolation

Memory ECC

CPU fault isolation

QPI CRC Retry mechanism upon errors at the link layer

24 I/OPCIe advanced error report

25 Redundant I/O paths26

QPICRC protection for QPI packets

27 Retry mechanism upon errors at the link layer

RAS - RELIABILITY, AVAILABILITY, AND SERVICEABILITY

L2

Slajd 19

L2 QPI只有QPI CRC技术，其他QPI都不支持LocalAccount; 2014-08-20

ZINTEGROWANE ZARZĄDZANIE

Black boxLocates a fault instantly, which is similar to a black box for airplanes

Screen recordingKVM videos record the running and exception information about the system in real time

Left unattendedDevice exceptions are automatically reported by emails

Power cappingThe cabinet density can be improved by 60%Intelligent power management

Dynamic PSU hibernation reduces power consumption by up to 16%Real-time Monitoring

Real-time temperature monitoring of key components such as processors and DIMMsReal-time monitoring of the fan speed

IPMI 2.0Provides intelligent monitoring for the server, complying with IPMI 2.0

Web managementProvides web-based management UIs without the need of installing any management software

KVM over IPSupports virtual media, and provides the remote virtual drive and floppy drive service

Seamless integrationHuawei eSight centralized management softwareSupports CA, Openview, and System center integration management

Easy managementIndependent 10/100/1000 M BMC out-of-band management network portSupports SOL

Remote managementSupports the remote BIOS/Firmware upgrade

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1RU / 2RU – 2 SOCKETS – RACK SERVERSHighlightsRH1288 V3

RH2288 V3

RH2288H V3

• 4 x NVMe SSD

•Flexible configurations of storage and I/O modules

• Dual built-in Mini SSDs• RAID1 supported

• E5-2600 v4• Up to 20 cores

Web HPC

Cloud computing Big data

• Max. 27 x 2.5'' HDD/SSD

• or 16 x 3.5'' HDD

• RH2288H V3 supports

more PCIe slots

RH

1288 V3

Front view

Rear view

• Upgraded performance: Supports a maximum of two E5-2600 v3/v4 series CPUs and 40 computing cores, the high-performance GPU, and the enhanced floating-point computing capability.

• Ultra-high density: Provides two CPUs in the 1U space, more than twice the density in common rack servers, and suitable for enterprise computing-intensive applications.

• Simple maintenance: Unified and remote graphical management, supports fault diagnosis digital tube, real-time display of the fault code information at a glance.

Advantages

Item 1U 2P Rack Servers

Number of CPUs One or two

CPU model Intel Xeon E5-2600 v3/v4 series processors, support a maximum of 135 W processor

DIMM slots 16 x DDR4 DIMM/LDIMM slots

Number of hard disks 8 x 2.5-inch SAS/SATA/SSD hard disks(NVMe model supports 4x NVMeSSD disks); 4 x 3.5-inch SAS/SATA hard disk

RAID support Supports RAID0, 1, 10, 5, 50, 6, and 60; supports the supercapacitor

PCIe expansion A maximum of 3 PCIe expansion slots

LOM 4 x GE, 2 x GE, or 2 x 10GE

PSU Two hot-swappable PSUs, support 1+1 redundancy

Fan module Five hot-swappable counter-rotating fan modules, allow one-fan failures

Operating temperature 5 -45

RH 1288 V3 - SZCZEGÓŁY

RH

2288 V3

Front view

Rear view

• Upgraded performance: The RH2288 V3 supports two E5-2600 v3/v4 series CPUs and the latest DDR4 memory technology, and its computing performance is greatly improved.

• Ultra-large storage capacity: A maximum of 96 TB local storage capacity can be configured, which is suitable for the distributed database and data analysis application.

• Simple maintenance: The RH2288 V3 adopts unified and remote graphical management, supports the LED digital diagnosis panel, and opens the digital management era.

Advantages

Item 2U 2-socket rack server

Number of CPUs One or two

CPU model Intel Xeon E5-2600 v3/v4 series processors

DIMM slots 16 x DDR4 DIMM/LDIMM slots

Number of hard disks 8 x 2.5-inch hard disks; 10 x 3.5-inch hard disks; 12 x 3.5-inch + 2/4 x 2.5/3.5-inch hard disks(NVMe model supports 4x NVMe SSD disks); 25 x 2.5-inch +2/3 x 2.5-inch hard disks

RAID supportSupports the RAID0, 1, 10, 5, 50, 6, and 60; supports the supercapacitor

PCIe expansion A maximum of six PCIe expansion slots

LOM 4 x GE, 2 x GE, or 2 x 10GE

PSU Two hot-swappable PSUs, support 1 + 1 redundancy

Fan module Four hot-swappable counter-rotating fan modules, support N+1 redundancy

Operating temperature 5 -45

RH2288 V3 - SZCZEGÓŁY

RH

2288H V3

Front view

Rear view

• Upgraded performance: The RH2288H V3 supports two E5-2600 v3/v4 series CPUs, a maximum of 44 computing cores, and two high-performance GPUs, and upgrades the floating-point computing capabilities.

• Ultra-large storage capacity: A maximum of 96 TB local storage capacity can be configured, which is suitable for the distributed database and data analysis application.

• Simple maintenance: The RH2288H V3 adopts the unified and remote graphical management, supports the touch-screen LCD diagnosis panel with various information clear at a glance.

Advantages

Item 2U 2-socket rack server

Number of CPUs One or two

CPU model Intel Xeon E5-2600 v3/v4 series processors

DIMM slots 24 x DDR4 DIMM/LDIMM slots

Number of hard disks 8 x 2.5-inch hard disks; 10 x 3.5-inch hard disks; 12 x 3.5-inch + 2/4 x 2.5/3.5-inch hard disks(NVMe model supports 4x NVMe SSD disks); 25 x 2.5-inch +2/3 x 2.5-inch hard disks

RAID support Supports the RAID0, 1, 10, 5, 50, 6, and 60; supports the supercapacitor

PCIe expansion A maximum of nine PCIe expansion slots

LOM 4 x GE, 2 x GE, or 2 x 10GE

PSU Two hot-swappable PSUs, support 1 + 1 redundancy

Fan modules Four hot-swappable counter-rotating fan modules, support N+1 redundancy

Operating temperature 5 -45

RH2288H V3 - SZCZEGÓŁY

TYLKO PAMIĘCI NVMe

Accelerates service performance

Cloud/VDIVM deployment density 2x

Distributed storageData read/write IOPS 5x

Data indexing/Big Data analyticsData query performance per second 6x

OLTP databaseTPS 10x

Huawei RH2288H V3supports 4/12/24 NVMe SSDs

All-NVMeSERVER

Virtual desktop Graphics processingHPC• Tesla K10, single-slot, 225

W• Tesla K20, dual-slot, 225 W• Tesla K80, dual-slot, 300 W • Applies to high-performance

computing (HPC).

• Quadro K2000: 384 cores

• High-speed display memory: 2

GB Memory

• Single-card: 51 W

• NIVIDA GRID K1&K2• The full-height full-length dual-

slot• The GPU pass-through,

applies to the graphics processing requirements of desktop cloud users.

• K1: 130 W • K2: 225 W

WYSOKA SKALOWALNOŚĆ I WYDAJNOŚĆ GPU

The RH2288H V3 provides a maximum of nine PCIe slots, supports two dual-slot GPUs, meets the graphics processing, high-performance computing, and virtual desktop application requirements.

4 RU - 2 SOCKETS - RACK SERVER

5288

40 large-capacity hard disks

Dual Mini SSDs Dual RAID cards

Typical Application Scenarios

Video surveillance

• 2 x E5-2600 v3/v4, up to 44 cores

• 16 x DDR4 DIMM

• 40 x 3.5-/2.5'' hard disk

Distributed storage Big data

4U – 4 / 8 SOCKETS – RACK SERVER

Typical Application Scenarios

RH5885H V3/RH5885V3

RH8100 V3

Physical partition8-socket

40°CStable running

1 minuteMaintenancewith Hot swap

60 or 53RAS

features

• E7 v4• Max. 24 x HDD/SSD• 192 x DDR4 DIMM

• E7 v4• Max. 23 HDDs, NVMe supported• 96/48 x DDR4 DIMM

Business intelligence

Large-scale virtualization

In-memory+Reliability and uptime

Scalability

In-memory computingDatabase

STABILNA I NIEZAWODNA ARCHITEKTURA

Stable running in 45°C Shock absorption design, reduces the device fault rate

Note: The optimized air vents, high-efficiency fan modules and PID adjustment of fan speed, support 45°C operating temperature, 10°C higher than that supported by mainstream servers (10°C-35°C).

The comprehensive optimization design ensures the reliable running of the device, and the fault rate is the lowest in the industry.

Note: 1) The fan component shock isolation and hard disk tray shock absorption design are designed to avoid HDD-sensitive frequencies and to decrease risks of HDD performance deterioration caused by rotating components.2) Reasonable packaging is designed to

effectively reduce the impact of shocks and to ensure system reliability during the transport.

Carrier-class components and derating design

Polymer capacitorsX7R capacitors are required in thermal-sensitive areasGold-plated connectors

Note: 1) All use Huawei carrier-class high-reliability components and authentication process.

2) The derating design of Huawei servers lowers the electric and temperature stress on components, delaying the parameter degradation, prolonging the life cycle, and increasing the reliability.

WYDAJNOŚĆ I NIEZAWODNOŚĆ CHŁODZENIA PŁYNEM

>>> >>>

Cooling PUE ≤ 1.1 Supports 45°C warm water cooling, with a

liquid cooling ratio of up to 80%.

TCO 30%↓ High energy efficiency enables greater value

than traditional mode.

217 test items Ensures comprehensive reliability from

components to system.

101%88%

83%80%79%78%

7…76% 7…

0%

20%

40%

60%

80%

100%

120%

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