Post on 18-Jul-2020
PAMIĘCI NVMePRZYSZŁOŚĆ PAMIĘCI SZYBKIEGO DOSTĘPU
RAFAŁ SŁONIEWSKI
Solutions Manager
W JAKIM KIERUNKU ZMIERZA RYNEK – PRZYSZŁOŚĆ TO SSD
0
5 000
10 000
15 000
20 000
25 000
30 000
2013 2014 2015 2016 2017 2018
PCIe SSD Shipment(PB)SATA/SAS SSD Shipment(PB)
Shipments of PCIe SSD and SATA SSD in ServerSource: Gartner 2015.Q2Shipment�(PB)
SSD replaces SAS HDD, PCIe SSD replaces SATA SSD.
PCIe SSD performance is over 10 times than SATA SSD.
010 00020 00030 00040 00050 00060 00070 00080 00090 000
100 000
SAS HDD Shipment Enterprise SSD Shipment PB
Shipments of Enterprise SSD and SAS HDD in ServerShipment (PB)
800,00
0
84,000700 160
PCIe SSDSATA SSD 15Krpm
SAS HDD
7.2Krpm
SATA
HDD
4KB�Random�Read�IOPS
PCIE SSD
750 000
60 000700 15 000
PCIe�SSD�Card SATA�SSD 15k�rpm
SAS�HDD
24*�SAS�HDDs
FC�Array
4KB�Read�IOPS�Performance�
16 667
7 500
78 43
PCIe�SSD�Card SATA�SSD 15k�rpm
SAS�HDD
24*�SAS�HDDs
FC�Array
IOPS/Watt�Comparison�
NVMe (Non-Volatile Memory Express) standard unifies the driver of different
vendors’ PCIe SSDs, integrates the driver into OS.
6.5/6.6/6.7/7.0/7.1
SLES�11�SP3SLES�12
13/14
ESXi�6.0vSphere�6.0
NVME DRIVER ECOSYSTEM
PCIe adapter card
RAID card
CPU2
CPU1
PCIe x16
PCIe x8
SAS x4SAS x4
PCIe x4PCIe x4PCIe x4PCIe x4
EXP
HDD0
HDD1
HDD2
HDD3
HDD4
HDD5
HDD6
HDD7
HDD8
HDD9
HDD10
HDD11
12x3.5’ disk backplane
Mini SAS HD lanes
Mini SAS HD lanes
/NVMe SSD
/NVMe SSD
/NVMe SSD
/NVMe SSD
NVMe SSD DISK TOPOLOGIA POŁĄCZEŃ
SCENARIUSZE PRACY: OLTP/OLAP DB, VDI, INDEXING
Step�1:�high�price,�low�capacity• High-end OLTP DB• ISP searching began usingProduct: PCIe SSD card
Step�2:�price�down,�capacity�up• OLTP DB, ISP large-scale use• Data warehousing, VM began usingProduct: PCIe SSD card, SATA SSD disk
Step�3:�lower�price,�larger�capacity• Big data, data warehousing• ISP, OLTP DBProduct: SATA SSD disk, PCIe SSD cardTrends: NVMe PCIe SSD disk/card
Indexing
Data�WarehousingVirtual�Desktop
OLTP�Database
Front-End�Web
40 nm 34 nm 25 nm 19/20 nm 15/16 nm 3DNAND Flash
SCENARIUSZE WYKORZYSTANIA
Database Virtualization CDN Big Data Searching HPCA large number of VDIs boot, produce sudden high concurrency IO, require high IOPS performance.
High concurrency, data volume, target data block is small and discrete, requiring large storage capacity and high IOPS performance.
Hot prominent, high concurrent access, require high read bandwidth and IOPS.
Large amount of data, data discrete, short-term high concurrent access, require low latency, high concurrency, randomness.
Small blocks of high frequency data read and write operations, require low latency and high IOPS.
Short of massive data processing (read and write), require high bandwidth, IOPS high, low latency.
Low access latency, high-throughput (IOPS), high bandwidth, high random access
TECHNOLOGIE WSPIERAJĄCE NVME
NVMControl technologies are the product features set for high-performance and high-reliability, include IOControl and DataControl.
• 3.2 GB/s Bandwidth• 800,000 IOPS• 18µs Latency
• 2,000,000 Hours MTBF• AFR ≤ 0.44%• UBER 10-17
WYDAJNOŚĆ MYSQL OLTP POPRAWIONA 15x
Using two ES3000 V3 to replace the local HDDs, and use LVM mirroring manager to make data redundancy. OLTP performance improved almost 15x Support DRBD + Pacemaker + Corosync to make cluster
Before
RAID 1
OS
RAID 10
Database�files
After
RAID 1
OS
LVM Mirroring
Database�files
RAID 1
LVM�Log
MySQL�OLTP�performance (bigger�is�better)(Transaction Per Second, TPS)
294
4528ES3000 Solution
Local HDDs Solution
Improve 15x
WYDAJNOŚĆ SQL OLTP POPRAWIONA 10x
Using two ES3000 V3 to replace the local HDDs, and use Soft RAID 1 to make data redundancy. OLTP performance improved almost 10x Support AlwaysOn to make cluster
Before
RAID 1
OS
RAID 5
Database�files
After
RAID 1
OS
Soft RAID 1
Database�files
SQL�Server�OLTP�performance (bigger�is�better)(Transaction Per Second, TPS)
644
6204ES3000 Solution
Local HDDs Solution
Improve 10x
BOOT STORM! WIĘCEJ VDI
Adding one ES3000 V3 into VDI server as a cache device. solve the boot storm, boot time 20 seconds, reduces 96%. VDI density from 30 to 50, increase 67%. Keep the original solution architecture
ES3000 Cache Solution(50 VDIs)
Local HDDsSolution(30 VDIs)
VDI�Boot�Time (smaller�is�better)
Saving 96%
480�s
20�s
VDI�Clients
ES3000�V2VDI�Server
Internet
PEŁNE PORTFOLIO SERWERÓW WSPIERAJĄCYCH DYSKI NVME
RH1288 V3 (4 NVMe SSDs)
XH620 V3 (2 NVMe SSDs)
RH2288H V3 (12 NVMe SSDs)
RH2288H V3 (24 NVMe SSDs)
5288 V3 (4 NVMe SSDs)
RH2288(H) V3 (4 NVMe SSDs)
ES3600P V3 NVMe SSDs
CH121 V3 (2 NVMe SSDs)
CH225 V3 (12 NVMe SSDs)
CH242 V3 (4 NVMe SSDs)RH5885(H) V3 (4 NVMe SSDs)
RH8100 V3 (8 NVMe SSDs)
SHOW ME YOUR NVMe
RHx288RODZINA SERWERÓW RACK
RAFAŁ SŁONIEWSKI
Solution Manager
SMI2
SMI2
QPI
PCIe
PCH
Hard disk
backplane
PCIe
BMC
PCIe expansion
BIOS
Management chipRAID controller card
NC Interconnect chip
Converged I/Ochip
SSD Huawei develop
GDZIE ZACZYNA SIĘ OPTYMALIZCJA?
INNOWACYJNOŚĆ ROZWIĄZAŃ
Engineering innovation
Engineering innovation
Chipinnovation
Chipinnovation
Architectureinnovation
Telecom Internet
DEMTHigh-voltage DCDEMTHigh-voltage DC
Modular serverIndustry's first PCIe
SSD card
Modular serverIndustry's first PCIe
SSD card
Management chip ASIC
SSD controller
Management chip ASIC
SSD controller
Memory hot swapLiquid coolingMemory hot swapLiquid cooling
Fault-tolerant server, hyper-
converged infrastructure
Fault-tolerant server, hyper-
converged infrastructure
Black box, high-temperature running
(55°C)
Black box, high-temperature running
(55°C)
ATCA architectureATCA architecture
x86 midrange computerx86 midrange computer
All industries
Converged I/O chipRAID controller cardConverged I/O chipRAID controller card
CPU hot swap, photonic interconnectCPU hot swap, photonic interconnect
DC3.0Resource decoupling
DC3.0Resource decoupling
VDI appliance and SPARK appliance
SAP HANA appliance, virtualization appliance
Internet application server
Application solution
innovation
RAS - RELIABILITY, AVAILABILITY, AND SERVICEABILITY
Proactive Failure Analysis Engine (PFAE)Forward-looking fault management, reducing the ratio of system crashes and data errors resulting from component faults
Replacement of core parts with zero downtime DIMM failure ratio comes second only to hard disk failure ratio. Replacing core parts with standard RAS features requires a system shutdown. Huawei RAS 2.0 enables hot swap for CPUs and DIMMs.
Modular design for tool-free O&M without opening the chassis cover; 8-inch touchscreen LCD for GUI-based management and efficient O&M
100% modular design for tool-free O&M
Proprietary management chip
BMC/BIOS source code
Full redundancy design
Autonomous chip error correction and tolerance Fault recording
Automatic fault recording and comprehensive collection
Fault analysis, prewarning, and presentation
Online error correction
CPU, DIMM, and NC, etc.Core FRU hot swap
Automatic isolation, FRU replacement
Hardware Layer
Firmware Layer
OS Layer Maximum fault avoidance
Minimal impact on functions in case of
faults
Quickest possible replacement
if functions are affected
Capable of +99.999% reliability
The 2-socket rack servers provides up to 27 RAS enhanced technologies for high-reliability applications, improving the system reliability.
CPU kernel isolationCPU power detection
Mem
ory
CPU CPU
Mem
oryM
emory
Mem
ory
Mem
oryM
emory
Mem
oryM
emory
PCIe devicePCIe fault reportMemory check, automatic inspectionSingle-granularity data checkMemory mirroringMemory backupMemory address parity check
No. Type RAS Feature1
System architecture
System error records2 Fault diagnosis
3Fault tolerant management framework combining software and hardware (eMCA2)
4 Isolation of faulty components5 PFA fault precaution6 Enhanced SMM (eSMM)
7
OS
Isolation of memory pages, memory blocks, and DIMMs
8 Online service migration9 Online OS upgrade
10 Multiple copies of key codes11
Memory
Memory check and automatic inspection12 Failed DIMM identification and isolation13 Single Device Data Correction (SDDC)14 Memory temperature adjustment
15 Device Tagging (replacement of the faulty granule)
16 Memory redundancy (Memory MultiRank Sparing)
17 Memory mirroring (Mirroring)
18Memory address parity protection (DDR4 Address & Command Parity Retry)
19Data Scrambling (the data transmission performs pseudo random scrambling, to achieve distribution of 0s and 1s)
20
CPU
Kernel isolation configuration21 Socket isolation
22 The out-of-band system accesses MCA registers by using the PECI
23 IVR (core/socket voltage check)
Memory isolation
Memory ECC
CPU fault isolation
QPI CRC Retry mechanism upon errors at the link layer
24 I/OPCIe advanced error report
25 Redundant I/O paths26
QPICRC protection for QPI packets
27 Retry mechanism upon errors at the link layer
RAS - RELIABILITY, AVAILABILITY, AND SERVICEABILITY
L2
Slajd 19
L2 QPI只有QPI CRC技术,其他QPI都不支持LocalAccount; 2014-08-20
ZINTEGROWANE ZARZĄDZANIE
Black boxLocates a fault instantly, which is similar to a black box for airplanes
Screen recordingKVM videos record the running and exception information about the system in real time
Left unattendedDevice exceptions are automatically reported by emails
Power cappingThe cabinet density can be improved by 60%Intelligent power management
Dynamic PSU hibernation reduces power consumption by up to 16%Real-time Monitoring
Real-time temperature monitoring of key components such as processors and DIMMsReal-time monitoring of the fan speed
IPMI 2.0Provides intelligent monitoring for the server, complying with IPMI 2.0
Web managementProvides web-based management UIs without the need of installing any management software
KVM over IPSupports virtual media, and provides the remote virtual drive and floppy drive service
Seamless integrationHuawei eSight centralized management softwareSupports CA, Openview, and System center integration management
Easy managementIndependent 10/100/1000 M BMC out-of-band management network portSupports SOL
Remote managementSupports the remote BIOS/Firmware upgrade
Rel
iabl
eR
elia
ble G
reenG
reenO
penO
penIn
telli
gent
Inte
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nt
1RU / 2RU – 2 SOCKETS – RACK SERVERSHighlightsRH1288 V3
RH2288 V3
RH2288H V3
• 4 x NVMe SSD
•Flexible configurations of storage and I/O modules
• Dual built-in Mini SSDs• RAID1 supported
• E5-2600 v4• Up to 20 cores
Web HPC
Cloud computing Big data
• Max. 27 x 2.5'' HDD/SSD
• or 16 x 3.5'' HDD
• RH2288H V3 supports
more PCIe slots
RH
1288 V3
Front view
Rear view
• Upgraded performance: Supports a maximum of two E5-2600 v3/v4 series CPUs and 40 computing cores, the high-performance GPU, and the enhanced floating-point computing capability.
• Ultra-high density: Provides two CPUs in the 1U space, more than twice the density in common rack servers, and suitable for enterprise computing-intensive applications.
• Simple maintenance: Unified and remote graphical management, supports fault diagnosis digital tube, real-time display of the fault code information at a glance.
Advantages
Item 1U 2P Rack Servers
Number of CPUs One or two
CPU model Intel Xeon E5-2600 v3/v4 series processors, support a maximum of 135 W processor
DIMM slots 16 x DDR4 DIMM/LDIMM slots
Number of hard disks 8 x 2.5-inch SAS/SATA/SSD hard disks(NVMe model supports 4x NVMeSSD disks); 4 x 3.5-inch SAS/SATA hard disk
RAID support Supports RAID0, 1, 10, 5, 50, 6, and 60; supports the supercapacitor
PCIe expansion A maximum of 3 PCIe expansion slots
LOM 4 x GE, 2 x GE, or 2 x 10GE
PSU Two hot-swappable PSUs, support 1+1 redundancy
Fan module Five hot-swappable counter-rotating fan modules, allow one-fan failures
Operating temperature 5 -45
RH 1288 V3 - SZCZEGÓŁY
RH
2288 V3
Front view
Rear view
• Upgraded performance: The RH2288 V3 supports two E5-2600 v3/v4 series CPUs and the latest DDR4 memory technology, and its computing performance is greatly improved.
• Ultra-large storage capacity: A maximum of 96 TB local storage capacity can be configured, which is suitable for the distributed database and data analysis application.
• Simple maintenance: The RH2288 V3 adopts unified and remote graphical management, supports the LED digital diagnosis panel, and opens the digital management era.
Advantages
Item 2U 2-socket rack server
Number of CPUs One or two
CPU model Intel Xeon E5-2600 v3/v4 series processors
DIMM slots 16 x DDR4 DIMM/LDIMM slots
Number of hard disks 8 x 2.5-inch hard disks; 10 x 3.5-inch hard disks; 12 x 3.5-inch + 2/4 x 2.5/3.5-inch hard disks(NVMe model supports 4x NVMe SSD disks); 25 x 2.5-inch +2/3 x 2.5-inch hard disks
RAID supportSupports the RAID0, 1, 10, 5, 50, 6, and 60; supports the supercapacitor
PCIe expansion A maximum of six PCIe expansion slots
LOM 4 x GE, 2 x GE, or 2 x 10GE
PSU Two hot-swappable PSUs, support 1 + 1 redundancy
Fan module Four hot-swappable counter-rotating fan modules, support N+1 redundancy
Operating temperature 5 -45
RH2288 V3 - SZCZEGÓŁY
RH
2288H V3
Front view
Rear view
• Upgraded performance: The RH2288H V3 supports two E5-2600 v3/v4 series CPUs, a maximum of 44 computing cores, and two high-performance GPUs, and upgrades the floating-point computing capabilities.
• Ultra-large storage capacity: A maximum of 96 TB local storage capacity can be configured, which is suitable for the distributed database and data analysis application.
• Simple maintenance: The RH2288H V3 adopts the unified and remote graphical management, supports the touch-screen LCD diagnosis panel with various information clear at a glance.
Advantages
Item 2U 2-socket rack server
Number of CPUs One or two
CPU model Intel Xeon E5-2600 v3/v4 series processors
DIMM slots 24 x DDR4 DIMM/LDIMM slots
Number of hard disks 8 x 2.5-inch hard disks; 10 x 3.5-inch hard disks; 12 x 3.5-inch + 2/4 x 2.5/3.5-inch hard disks(NVMe model supports 4x NVMe SSD disks); 25 x 2.5-inch +2/3 x 2.5-inch hard disks
RAID support Supports the RAID0, 1, 10, 5, 50, 6, and 60; supports the supercapacitor
PCIe expansion A maximum of nine PCIe expansion slots
LOM 4 x GE, 2 x GE, or 2 x 10GE
PSU Two hot-swappable PSUs, support 1 + 1 redundancy
Fan modules Four hot-swappable counter-rotating fan modules, support N+1 redundancy
Operating temperature 5 -45
RH2288H V3 - SZCZEGÓŁY
TYLKO PAMIĘCI NVMe
Accelerates service performance
Cloud/VDIVM deployment density 2x
Distributed storageData read/write IOPS 5x
Data indexing/Big Data analyticsData query performance per second 6x
OLTP databaseTPS 10x
Huawei RH2288H V3supports 4/12/24 NVMe SSDs
All-NVMeSERVER
Virtual desktop Graphics processingHPC• Tesla K10, single-slot, 225
W• Tesla K20, dual-slot, 225 W• Tesla K80, dual-slot, 300 W • Applies to high-performance
computing (HPC).
• Quadro K2000: 384 cores
• High-speed display memory: 2
GB Memory
• Single-card: 51 W
• NIVIDA GRID K1&K2• The full-height full-length dual-
slot• The GPU pass-through,
applies to the graphics processing requirements of desktop cloud users.
• K1: 130 W • K2: 225 W
WYSOKA SKALOWALNOŚĆ I WYDAJNOŚĆ GPU
The RH2288H V3 provides a maximum of nine PCIe slots, supports two dual-slot GPUs, meets the graphics processing, high-performance computing, and virtual desktop application requirements.
4 RU - 2 SOCKETS - RACK SERVER
5288
40 large-capacity hard disks
Dual Mini SSDs Dual RAID cards
Typical Application Scenarios
Video surveillance
• 2 x E5-2600 v3/v4, up to 44 cores
• 16 x DDR4 DIMM
• 40 x 3.5-/2.5'' hard disk
Distributed storage Big data
4U – 4 / 8 SOCKETS – RACK SERVER
Typical Application Scenarios
RH5885H V3/RH5885V3
RH8100 V3
Physical partition8-socket
40°CStable running
1 minuteMaintenancewith Hot swap
60 or 53RAS
features
• E7 v4• Max. 24 x HDD/SSD• 192 x DDR4 DIMM
• E7 v4• Max. 23 HDDs, NVMe supported• 96/48 x DDR4 DIMM
Business intelligence
Large-scale virtualization
In-memory+Reliability and uptime
Scalability
In-memory computingDatabase
STABILNA I NIEZAWODNA ARCHITEKTURA
Stable running in 45°C Shock absorption design, reduces the device fault rate
Note: The optimized air vents, high-efficiency fan modules and PID adjustment of fan speed, support 45°C operating temperature, 10°C higher than that supported by mainstream servers (10°C-35°C).
The comprehensive optimization design ensures the reliable running of the device, and the fault rate is the lowest in the industry.
Note: 1) The fan component shock isolation and hard disk tray shock absorption design are designed to avoid HDD-sensitive frequencies and to decrease risks of HDD performance deterioration caused by rotating components.2) Reasonable packaging is designed to
effectively reduce the impact of shocks and to ensure system reliability during the transport.
Carrier-class components and derating design
Polymer capacitorsX7R capacitors are required in thermal-sensitive areasGold-plated connectors
Note: 1) All use Huawei carrier-class high-reliability components and authentication process.
2) The derating design of Huawei servers lowers the electric and temperature stress on components, delaying the parameter degradation, prolonging the life cycle, and increasing the reliability.
WYDAJNOŚĆ I NIEZAWODNOŚĆ CHŁODZENIA PŁYNEM
>>> >>>
Cooling PUE ≤ 1.1 Supports 45°C warm water cooling, with a
liquid cooling ratio of up to 80%.
TCO 30%↓ High energy efficiency enables greater value
than traditional mode.
217 test items Ensures comprehensive reliability from
components to system.
101%88%
83%80%79%78%
7…76% 7…
0%
20%
40%
60%
80%
100%
120%
0100200300400500600700800
1 2 3 4 5 6 7 8 9
TCO
com
paris
on
TCO
(CN
Y0k)
Operation year
风冷TCO液冷TCOTCO比例
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