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Układy Cyfrowe i Systemy Wbudowane 1

II. Układy konfigurowalne

dr inż. Jarosław SugierJaroslaw.Sugier@pwr.edu.pl

W-4/K-9 pok. 227 C-3

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IC Fabrication Process

(C) Taiwan Semiconductor Manufacturing Co., Ltd.J. Rabaey, A. Chandrakasan, B. Nikolic: Digital integrated circuits

(C) Taiwan Semiconductor Manufacturing Co., Ltd.

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Full custom ASIC

• E.g. Cadence: Virtuoso

• Synopsys: Custom Compiler / Design Compiler

• Mentor (Siemens group): Calibre4

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3-input NAND cell

Standard Cell Libraries

• Np. biblioteka sxlib oprogr. Alliance: (Laboratoire d'Informatique de Paris 6)

Design mapped to cells| Placement| Power routing| Clock tree synthesis

From a tutorial by

C. Batten, Cornell Univ.

| Final design (fully routed, critical path highlited)

• Np. Synopsys Educational 90nm Standard-Cell Libraries i IC Compiler:

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Gate Arrays

Lata 80., 90. …

• S-MOS Systems, SLA6140:

• NEC, Hitachi, Fujitsu…

• Atmel: ATL25 Gate Array ASIC ATL25 Embedded Array ASIC

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Programmable Logic Devices (PLD):

Complex PLD:

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Field Programmable Gate Arrays (FPGA)

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JS UCiSW1Koszty stałeFPGA G.A. S.C.

Training (days) 2 5 5

$400 / day $800 $2 000 $2 000

Workstation $10 000 $10 000 $10 000

Software $1 000 $20 000 $40 000

Design (10k gates)

gates / day 500 200 200

days 20 50 50

$400 / day $8 000 $20 000 $20 000

Production test design 0 5 days 5 days

0 $2 000 $2 000

NRE 0 $30 000 $70 000

masks 0 (3÷4) $10 000 (15+)$50 000

simulation 0 $10 000 $10 000

test 0 $10 000 $10 000

Second source (5days) (5days) (5days)

(projekt „awaryjny”) $2 000 $2 000 $2 000

Total $21 800 $86 000 $146 000

Michael J.S. Smith, ASIC

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JS UCiSW1Koszty jednostkowe

FPGA G.A. S.C. unit

Wafer size 6 6 6 inches

Wafer cost 1 400 1 300 1 500 $

Design size 10k 10k 10k gates

Density 10k 20k 25k gates/cm2

Utilization 60% 85% 100%

Die size 1.67 0.59 0.40 cm2

Die / wafer 88 248 365

Defect density 1.10 0.90 1.00 cm-2

Yield 65% 72% 80%

Die cost 25 7 5 $

Profit margin 60% 45% 50%

Part cost 39 10 8 $

Price / gate 0.39 0.10 0.08 cents

Michael J.S. Smith, ASIC 10

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Wyrównanie:

FPGA vs. Gate Array ≈ 2.000 szt.

Gate Array vs. Standard Cells ≈ 30.000 szt.

10 000

100 000

1 000 000

10 100 1 000 10 000 100 000

SC GA FPGA

[Total $]

[Volume]

Koszt [$] FPGA G.A. S.C.

stały 21 800 86 000 146 000

jednostkowy 39 10 8

Koszt całkowity

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„Time to market” delay

Michael J.S. Smith, ASIC

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Bezpieczniki (Fuses)

3

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Antybezpieczniki

Actel: PLICE (Programmable Low-Impedance Circuit Element)

QuickLogic: ViaLink

Michael J.S. Smith, ASIC

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Metal-Oxide-Semiconductor Transistor

Structure:

n+

S G D

p-substrate

GND

n+

Induced channel:

Resistive (linear) operation: Saturation:

n+

S G D

p-substrate

GND

GND

VGS > VT VDS = 0

n+

n-channel

n+

S G D

p-substrate

GND

GND

VGS > VT VDS < VGS – VT

n+ n+

S G D

p-substrate

GND

GND

VGS > VT VDS > VGS – VT

n+

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EPROM

n+ Source n+ Drain

P-Type Silicon

VPP

VD < VPP

floating gate access gate

thin gate oxide

FAMOS = Floating-gate Avalanche-injection MOS

E2PROM

n+ Source n+ Drain

FLOTOX = FLOating – gate Thin OXide trans.

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Początki: pamięci PROM

D3 D2 D1 D0

0

1

2

255

DE

KO

DE

R

A0

A1

A2

A7

. .

.

.

.

.

.

.

.

.

.

.

.

.

.

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+VDD

I1

IN

T1

+VDD

TK

+VDD

F1

+VDD

FM

WE

WY

Matryca

AND

Matryca

OR

Matryca PLD

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. . . . . .

. . .

T1 TK

połączenia progr.

połączenia progr.

I1 I2 IN . . .

. . . . . .

. . .

F1 FM

. . . . . .

. . .

T1 TK

połączenia progr.

połączenia progr.

I1 I2 IN . . .

. . .

F1

. . .

FM

. . .

I1

IN

TK

FM

T1 T2 T3

F1

. . .

F2 . . .

4

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PAL(Programmable

Array Logic)

PLE(Programmable Logic Element)

PLA(Programmable

Logic Array)

Matr. AND: Progr. Const. Progr.

Matr. OR: Const. Progr. Progr.

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T0

F0

F1

F2

F3

T1 T2 T7

I0

I1

I2

. . .

Układy PLE

Np. 8x4:

⇔⇔⇔⇔

⇔⇔⇔⇔

O0

O1

O2

O3

OE (output enable)

IN OUT

OE

OE = 1 OUT = IN (0/1)

OE = 0 OUT = Z (HighZ)

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PAL16L8 0 3 4 7 8 11 12 15 16 19 20 23 24 27 28 31

0

7

0 3 4 7 8 1 1 1 2 1 5 1 6 19 20 23 24 27 28 31

8

1 5

16

2 3

24

3 1

3 2

3 9

4 0

4 7

4 8

5 5

5 6

6 3

I0

I1

I3

I4

I5

I6

I7

I8

I2

O8

I/ O7

I / O6

I/O 5

I/O 4

I/O3

I / O2

O1

11 I9

N D

VC C1

2

3

4

5

6

7

8

9

12

13

14

16

17

18

19

1 5

20

16 L8-5 ( -4)

1 0

16 L 8

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0 3 4 7 8 11 12 1 5 1 6 19 20 2 3 24 27 28 3 1

0

7

8

1 5

16

2 3

24

I 0

I1

I 3

I2

O8

I/ O 7

I / O6

VCC 1

2

3

4

1 7

1 8

1 9

2 0

16L8- 5 ( -4) 1 6 L 8

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PAL16R80 3 4 7 8 11 12 15 16 19 20 23 24 27 28 31

0

7

0 3 4 7 8 1 1 1 2 1 5 1 6 1 9 2 0 23 24 27 28 31

8

15

16

23

24

3 1

3 2

3 9

4 0

4 7

4 8

5 5

5 6

6 3

16R8-5 (-4)

2

3

4

5

6

7

8

9

1

18D Q

Q

19

17

16

15

14

13

12

11

O8

O7

O6

O5

O4

O3

O2

O1

OE

V

CLK

I1

I2

I3

I4

I5

I6

I7

I8

D Q

QV

D Q

QV

D Q

QV

D Q

QV

D Q

QV

D Q

QV

D Q

QV

G N D

VCC

1 0

20

16R8 ( 4)

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0 3 4 7 8 11 12 15 16 19 20 23 24 27 28 31

0

7

8

15

16

23

24

16R8-5 (-4)

2

3

4

1

18D Q

Q

19

17

O8

O7

O6

V

CLK

I1

I2

I3

D Q

QV

D Q

QV

VCC20

16R8 ( 4)

5

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0

1

9

SP

AR0 3 4 7 8 11 12 15 16 19 20 23 24 27 28 31 32 35 36 39 40 43

10

20

21

0 3 4 7 8 1 1 1 2 1 5 1 6 1 9 2 0 2 3 2 4 2 7 28 31 32 35 36 39 40 43

CLK/I0 1

(2)

2

(3)I1

3

(4)I2

4

( 5 )I3

5

( 6 )

I4

6

( 7 )

I5

7

( 9 )

I6

8

( 1 0 )

I7

9

( 1 1 )I8

1 0

( 1 2 )I9

1 1

( 1 3 )

I 1 0

1 2

( 1 4 )

G N D

24

(28) VCC

(16)

I1311

34

33

48

4 9

6 5

6 6

8 2

8 3

9 7

9 8

1 1 0

1 1 1

1 2 1

1 2 2

1 3 0

1 3 1

I/O923

(27)

8I/O22

(26)

I/O21

(25)7

I/O20

(24)

6

5I/O19

(23)

4I/O18

(21)

I/O17

(20)

3

I/O16

(19)

2

I/O15

(18)

1

I/O14

(17)

0

D

SP

ARQ

0

1

1 0

1 1

0 0

0 1

D

SP

ARQ

0

1

1 0

1 1

0 0

0 1

D

SP

ARQ

0

1

1 0

1 1

0 0

0 1

D

SP

ARQ

0

1

1 0

1 1

0 0

0 1

D

SP

ARQ

0

1

1 0

1 1

0 0

0 1

D

SP

ARQ

0

1

1 0

1 1

0 0

0 1

D

SP

ARQ

0

1

1 0

1 1

0 0

0 1

D

SP

ARQ

0

1

1 0

1 1

0 0

0 1

D

SP

ARQ

0

1

1 0

1 1

0 0

0 1

D

SP

ARQ

0

1

1 0

1 1

0 0

0 1

Q

Q

Q

Q

Q

Q

Q

Q

Q

Q

16564E-006

PALCE22V10

0

1

9

AR0 3 4 7 8 11 12 15 16 19 20 23 24 27 28 31 32 35 36 39 40 43

10

20

21

CLK/I0 1

(2)

2

(3)I1

3

(4)I2

4

( 5 )I3

24

(28) VCC

34

33

48

4 9

I/O923

(27)

8I/O22

(26)

I/O21

(25)7

I/O20

(24)

6

5I/O19

D

SP

ARQ

0

1

1 0

1 1

0 0

0 1

D

SP

ARQ

0

1

1 0

1 1

0 0

0 1

D

SP

ARQ

0

1

1 0

1 1

0 0

0 1

D

SP

ARQ

0

1

1 0

1 1

0 0

0 1

D AR

1 0

1 1

Q

Q

Q

Q

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Complex PLD

Glo

bal inte

rcon

ne

ct m

atr

ix

PA

L

I/O I/O I/O

MC

MC

MC

PA

L

I/O I/O I/O

MC

MC

MC

PA

L

I/O MC

MC

MC

I/O I/O

PA

L

I/O MC

MC

MC

I/O I/O

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Arch. XC9500XL

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Arch. XC9500XL

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VIN

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Boundary Scan logic

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State diagram for the TAP controller