[IEEE Comput. Soc 3rd IEEE International Workshop on System-on-Chip for Real-Time Applications -...
Transcript of [IEEE Comput. Soc 3rd IEEE International Workshop on System-on-Chip for Real-Time Applications -...
A 52 GHz VCO with Low Phase Noise Implemented in
SiGe BiCMOS Technology
Lin Jia, Alper Cabuk, Jian-Guo Ma, Kiat Seng Yeo, Manh Anh DoRFIC Group, Center for Integrated Circuit & Systems (CICS)
Nanyang Technological University, [email protected]
Abstract
A fully integrated 52 GHz millimeter wave LC VCO
with –106 dBc/Hz phase noise at 600 kHz offset frequency
and 0.93 GHz tuning range is reported in the paper using
IBM BiCMOS-6HP technology. The output voltage swing
of the VCO is about 0.4 Vp-p for the complementary
cross-coupled topology with the buffer. A bipolar device
is used as the tail transistor to supply constant a current
to preserve the oscillation of the VCO. The parasitics due
to interconnect metals are extracted from the layouts, the
effects of those parasitics on the VCO’s performance are
investigated. Based on the analyses, the optimized layout
of the complementary VCO is obtained, the pre-layout
and the post-layout simulations are compared and
presented in this paper.
1. Introduction
High frequency and low phase noise oscillators are
key components in achieving high performance and low
cost millimeter wave (MMW) applications such as
wireless communication systems and automotive radar
systems. Several monolithic MMW voltage controlled
oscillators (VCOs) have been reported using HEMT [1],
InP-based HBT [2] and CMOS technologies [3].
However, the phase noise is limited by the high intrinsic
1/f noise presented in HEMTs, the small tuning range as
well as high power consumption in InP based HBTs, and
the high substrate loss in CMOS technology [4]-[6]. The
SiGe BiCMOS is chosen in this paper because of its
impressive high frequency performance at both device
and circuit levels [7]. Furthermore, substrates used in
SiGe BiCMOS processes typically have a medium
receptivity of 10-20 -cm resulting in high quality
inductors compared to those made on the standard CMOS
processes. The thick metal layer that comes with the state-
of-the art SiGe technologies also improves the inductor
performance. This makes SiGe BiCMOS an attractive
alternative for the high frequency VCO design, where
both high-speed active and high-Q passive devices are
needed. The IBM BiCMOS-6HP technology has been
selected in our design.
In this paper, a microwave monolithic LC VCO using
the IBM BiCMOS-6HP technology is presented. The
MMIC VCO has been designed and post-layout
simulated. The oscillation frequency is as high as 51.8
GHz with a tuning range of 0.93 GHz, and a peak-to-peak
buffer output voltage of 0.4V. The phase noise is –89.5
dBc/Hz at 100 kHz offset frequency and –106 dBc/Hz at
600 kHz offset frequency. To the authors’ knowledge,
this is the highest oscillation frequency achieved for a
fundamental-mode VCO in an IBM BiCMOS-6HP
process with fT = 45 GHz. The phase noise performance
is almost 10 dBc/Hz better than that of a recently reported
50 GHz CMOS VCO [3].
2. LC VCO topology design strategy
The circuit diagram is shown in Fig. 1(a). A fully
integrated complementary cross-coupled configuration is
chosen because of the following advantages:
The oscillation amplitude of this structure is
approximately twice the amplitude of the nMOS-only
structure due to the pMOS cross coupled pair [8]-[11].
The differential operation of this topology makes the rise-
time and fall-time symmetrically during the oscillation
and results in a reduced 1/f noise upconversion [11] and
an improved phase noise performance for a given tail
current.
The bipolar tail transistor used in this topology improves
the phase noise performance of the VCO because the flick
noise of the bipolar is 10dB lower than that of MOS
transistor [13].
As shown in Fig. 1(b), a differential LC VCO can be
represented as a parallel RLC circuit. In this circuit, the
conductance, Gtank, represents the inductor and varactor
losses. Gactive is the effective negative conductance of the
active devices in the nMOS (Mn1 and Mn2) and the pMOS
(Mp1 and Mp2) cross-coupled pairs in order to compensate
for the loss of the tank. The cross-coupled VCO operates
as a switch: Firstly, it is noted that the oscillator forces
VGD of the nMOS transistors to be equal in the
magnitudes but with opposite signs to generate a
differential voltage across the resonator. At the zero
differential voltage, shown in Fig. 1 (c), both switching
nMOS transistors (Mn1 and Mn2) are in saturation region,
and they form a small-signal negative resistance that
induces the startup of the oscillation. As the differential
oscillation voltage crosses Vth, VGD of one nMOS ( Mn1)
exceeds +Vth, forcing it into the triode region; VGD of the
Proceedings of The 3rd IEEE International Workshop on System-on-Chip for Real-Time Applications ISBN 0-7695-1929-6/03 $17.00 © 2003 IEEE
other nMOS (Mn2) falls below +Vth, driving the device
into the deeper saturation, and then Mn2 turns off.
Mp1 Mp2
Mn1 Mn2
MosVar1 MosVar2
Inductor
Vdd
Vcontrol
Ibase
Mn4Mn3
Output1 Output2
R2R1
(a)
L C
Gta
nk
Gacti
ve
Saturation area
Differential Zero
(b) (c)
Similarly, as the falling differential oscillation voltage is
smaller than –Vth, VGD of one pMOS (Mp1) exceeds –Vth,
forcing it into the triode region, VGD of the other pMOS
(Mp2) forces this transistor into deeper saturation, and
then Mp2 turns off. Thus, the complementary LC VCO
operates when both nMOS and pMOS pairs are all in
saturation region firstly, then one nMOS and one pMOS
are at the off states, while other nMOS and pMOS are at
the triode region. Such switching process is periodical
throughout the operation of the VCO. The oscillation
frequency is LC
f2
10 . In order to sustain the
oscillation, the formula |Gactive| Gtank must be satisfied.
However, Gactive and Gtank are two main noise sources
during the operation of the VCO, here,
2
mpmn
active
GGG , Gmn and Gmp are the
transconductance of the nMOS and pMOS respectively,
thus optimized active devices can improve the
performance of the VCO phase noise.
effR
G1
tank , Reff
is the effective resistance which includes the tank parallel
resistor, Rp, the series parasitic resistor, Rl, of the inductor
and the series parasitic resistor, Rc, of the capacitor at the
oscillation frequency, 0f , and hence Reff can be expressed
as [7]:
2
0 )(
1
CRRRR
p
lceff (1)
High-Q inductor and the varactor are the most critical
elements in a VCO design when a low phase noise is
desired. However, due to the skin effect at microwave
frequencies, the inductor Q value and the self-resonation
frequency are reduced, thus, the targeted oscillation
frequency are shifted. In order to address these issues, the
IBM BiCMOS-6HP process is chosen in our design for
the following advantages [8]:
Its high resistive substrate reduces the Eddy
currents and the thick metallization minimizes
the skin effect. These features make it possible to
obtain Q values of around 20 for inductors at the
operation frequency.
The IBM BiCMOS-6HP process offers
transmission line inductors with deep trench
isolation further improving the inductor Q
values, and hence oscillation above 51 GHz with
low phase noise is feasible.
The Bipolar tail transistor schematized in Fig. 1 (a) can
be realized together with the CMOS circuit in this SiGe
BiCMOS process.
3. SiGe integrated inductor line and
mosvaractor
3.1. Inductor line
One of the key components for designing a low phase
noise oscillator is the high Q inductor. Unlike capacitors,
inductors are not readily available in a standard CMOS
technology. As a result, some design techniques have to
be used, that usually limit the performance of an inductor.
The active inductors could be very advantageous in high
frequency operation for VCO. However, the noise
generated by the active elements requires the use of an
excessive amount of power [15]. Recently, an inductor of
a folded bondwire has been proven to have low series
resistance and it is readily available in any IC technology.
The semiconductor industry is still hesitant to use this
technique because manufacturers cannot guarantee the
repeatability of the bonding process. Currently, various
spiral-shaped inductors have been designed and
fabricated on the silicon substrate using one or more
metal interconnection levels. However, the inductor Q
Fig. 1. (a) The topology of the complementary LC VCO
(b) Differential equivalent circuit
(c) Output voltage of oscillator
Proceedings of The 3rd IEEE International Workshop on System-on-Chip for Real-Time Applications ISBN 0-7695-1929-6/03 $17.00 © 2003 IEEE
value is limited by the series resistance of the metal traces
and the substrate loss.
For frequency around 50GHz, Microstrip line
inductors are used such as they can provide the required
low inductances at high Q value, The IBM BICMOS-6HP
technology offers a set of microstrip line inductors with
an additional deep trench layer underneath the inductor
lines to enhance the Q values further.
Fig. 2 shows L and Q values of the microstrip line
inductor and the spiral inductor versus frequency, both
aiming for a 50 pH inductance at 55 GHz operation
frequency. A simple microstrip line inductor exhibits a
50.6 pH inductance and a Q value of 28. Unfortunately,
the smallest spiral inductor available in the IBM library is
160 pH. The 50 pH inductance can be obtained by
paralleling three 160 pH spiral inductors, but the space is
5 times bigger than that of the microstrip line inductor
and the Q value is only 7. The feasibility of high
frequency and low phase noise LC VCO will be based on
the superiority of the microstrip line inductors.
3.2. Mosvaractor
Voltage-controlled capacitors, also called varactors,
are the key components in a VCO. A varactor diode,
which is formed by an intrinsic pedestal npn collector–
base diode, is offered by IBM BiCMOS-6HP technology.
The Cmax/Cmin ratio is about 12 for this structure, but the
varactor Q is less than 8 at 55 GHz.
The IBM BiCMOS-6HP process also offers an nMOS
varactor with a higher Q value, which is suitable for
realizing small capacitances for the high frequency VCO.
The capacitance and Q are shown in Fig. 3 at the
operation frequency of 55 GHz. A nMOS varactor
(MosVaractor) uses a thin oxide NFET in an N-well with
the N+ source and drain shorted together. The variable
capacitance is achieved by controlling the gate to
diffusion/N-well potential within the range from –0.7 V
to 1.0 V, which drives the device from the depletion to
the accumulation. The capacitance per unit area can be
varied from Cmax (5.8 fF/µm2) to the value of 40% of Cmax
over this range. There is also a slight dependence on the
channel width and length. At the gate to source-drain
voltage (Vg-sd) below –0.7 V and above 1.0 V, a
depletion region in the gate polysilicon layer starts to
grow, leading to a reduction in the capacitance. The
device is found to be robust for Vg-sd from –1 V to +1
V. The Cmax/Cmin ratio is about 2, but Q value is more
than 45.
4. Simulation and result discussion
4.1. Design and implementation of a VCO with low
phase noise oscillating above 51 GHz.
The LC oscillator’s schematic is given in Fig. 1(a).
The microstrip line inductor and the MosVaractor are
used in the tank configuration. A pair of coupled nMOS
transistors (Mn1 and Mn2) and a pair of coupled pMOS
transistors (Mp1 and Mp2) are used in the positive
feedback to provide a negative resistance. The other
nMOS pair (Mn4 and Mn5) with two 50 resistors (R1 and
R2) forms the buffer. The bipolar tail transistor is used to
improve the phase noise and to supply a constant current
into the tank for the stable oscillation.
The capacitance of the tank (Ctank) at one of the output
node is expressed by the following equation [14]:
gdp2
dbpgspgdn2
dbngsnvartankCCCCCCCC (2)
Where, Cvar is the capacitance of a MosVaractor. The
capacitance value 23 fF with the Q value of 50 can be
obtained from the capacitance extraction of the
MosVaractor at the operation frequency of 55 GHz in
Fig. 4 Cgsn, Cdbn, Cgdn, Cgsp, Cdbp, Cgdp are the well-known
parasitic capacitances associated to the devices, the
overall capacitance is calculated as Ctank =330.8 fF. The
inductance per tank, L=50.6/2=25.3 pH with Q=38, was
Fig. 2. The comparison of inductance and Q between
transmission line and spiral inductor at 50 GHz
Fig. 3. The capacitance and Q versus Vg-sd for
MosVaractor at the operation frequency of 50 GHz.
Proceedings of The 3rd IEEE International Workshop on System-on-Chip for Real-Time Applications ISBN 0-7695-1929-6/03 $17.00 © 2003 IEEE
determined from Fig. 2 at the operation frequency 55
GHz. The oscillator frequency, f0 = 55.04 GHz is
achieved for Vcont=2.4 V. To verify the calculated
frequency, the VCO is simulated using Cadence
SpectreRF Simulator for pre-layout schematic see Fig.
1(a) at the same controlled voltage, the simulation result
is 55.08 GHz, which is in good agreement with the
theoretical calculation.
The active device speed is also another concern for the
high frequency operation. The single device gain cut-off
frequency, T, may sometimes be misleading. Expressed
by the formula,)( gdgs
m
TCC
g, can be doubled for a
differential transistor structure [15]. The fully
complementary cross-coupled VCO topology is a
differential structure where the gate-source and gate-drain
capacitors that are viewed by each transistor, Cgs + Cgd,
are reduced to be half that of a single transistor. Hence,
even though the cutoff frequency of the nMOS transistor
is 45 GHz for the IBM BiCMOS-6HP technology [8], it is
still possible to design an LC VCO that can operate above
51 GHz.
A 51.8 GHz complementary cross-coupled LC VCO is
designed and simulated using the IBM BiCMOS-6HP
process. The power consumption of the VCO core is 9
mW and the total power consumption including the buffer
is about 25 mW. The VCO can be tuned from 50.77 GHz
to 51.8 GHz with the tuning range 0.93 GHz, and the
phase noise is about –89.5 dBc/Hz at 100 kHz offset
frequency and –106 dBc/Hz at 600 kHz offset frequency
from post-layout simulation respectively as shown in Fig.
4 and Fig. 5. To the best of authors’ knowledge, this is
the highest oscillation frequency for a fully integrated
VCO, which is designed using a commercial BiCMOS
technology.
4.2. The parasitic extraction and analysis
The parasitic components due to the interconnect
metals and the devices in the layout affect the operation
of the practical circuit, usually degrading the
performance. Parasitic coupling is inevitable, but it can be
minimized by a carefully layout drawing. The parasitic
capacitances and resistances are extracted and the
schematic is modified accordingly using special
components, RCnet, to represent the extracted parasitics
as presented in Fig. 6. The effects of these parasitic RCnet
components on the VCO performance are investigated.
There are two sets of critical nodes that have high
parasitic effect: the connection of the output buffer
transistor’s gate and the VCO core (the cross-coupled
nMOS transistor’s drain terminal), i.e. RCnet1 and
RCnet2. These parasitics shift the operation frequency.
The second critical connection is the one between the 50
resistor and the drain of buffer transistor, i.e. RCnet3
and RCnet4 . The amplitude of the output voltage is
Fig. 4. The tuning characteristics of the VCO.
Fig. 5. The phase noise performance of the VCO
Fig. 6. The schematic of the VCO with added
parasitic components
Proceedings of The 3rd IEEE International Workshop on System-on-Chip for Real-Time Applications ISBN 0-7695-1929-6/03 $17.00 © 2003 IEEE
reduced due to the parasitic resistances at this point. The
layout is optimized as much as possible to obtain the
minimum parasitic components at the nodes.
The maximum oscillation frequency is lowed by 5
GHz, and the phase noise is increased by 5 dB/Hz at 600
kHz frequency offset when the parasitic capacitance is
increased from 10 fF to 90 fF at the RCnet1 and RCnet2.
The frequency tuning range also suffers slightly from the
parasitics, and it is reduced by 150 MHz.
Based on above consideration, the optimized layout of the
LC VCO is presented in Fig. 7. The parasitic components
“RCnet” are extracted and the post-layout simulation are
done for our design. The comparisons between the pre-
layout and the post-layout simulation are demonstrated in
Fig. 4 and Fig. 5. The maximum oscillation frequency is
shifted down 3.28 GHz (from 55.1 GHz to 51.8 GHz), the
phase noise is degraded by 2.5 dB/Hz at 100 kHz offset
frequency (from 92 dBc/Hz to 89.5 dBc/Hz at 100 kHz
offset frequency). Thus, a 51.8 GHz LC VCO with low
phase noise is achieved by using IBM BiCMOS-6HP
technology, the performance is summarized in Table.1.
5. Conclusion
A low power and low phase noise VCO with
oscillation frequencies around 51.8 GHz with low phase
noise of –106dBc at the 600kHz offset frequency and a
frequency tuning range of 0.93 GHz is achieved using
the commercial IBM BiCMOS-6HP technology. The
operation of the fully complementary cross-coupled LC
VCO using Bipolar-T is analyzed and the parasitic
components in the layout are detailed. A simple
optimization method for the complementary LC VCO
layout is also employed in the design. Fully integrated
above 50GHz VCOs are the crucial blocks in SONET
systems operating at speeds higher than 40 Gb/s and in
the application of satellite communication operating at V-
band.
Table 1. Summary of VCO performances
Complementary Cross-
Coupled VCO Design
Pre-layout Post-layout
Maximum Frequency 55.08 GHz 51.8 GHz
Phase Noise @ 100KHz -92 dBc/Hz -89.5
dBc/Hz
Tuning Range* 1.1 GHz 0.93 GHz
Tuning % 2.0 1.8
Max. Output (core) 1.6 Vp-p 1.2 Vp-p
Max. Output (Buffer) 0.55 Vp-p 0.4 Vp-p
Total Bias Current 12.5 mA
Supply Voltage 2.0 V
Power Consumption
without buffer 9 mW
Power Consumption with
buffer 25 mW
Chip Area without buffer 120 x 152 m2
Chip Area with buffer 600 x 610 m2
6. References
[1]. Y. Kwon, “Large signal analysis and experimental
characteristics of monolithic InP-based W-band HEMT
oscillator,” in 21th European Microwave Conf. Tech Dig.,
Stuttgart, Germany, Sept. 1991, pp.99-101.
[2]. H. Wang, “Monolithic W-band VCO’s using
pseudomorphic AlGaAs/InGaAs/GaAs HEMT’s,” in 14th Ann.
IEEE GaAs IC Symmp. Dig., Miami, FL. Oct.1992, pp.47-50.
[3]. H. Wang, “A 50GHz VCO in 0.25 m CMOS,” in IEEE
Solid State Circuits Conference Digest of Technical Papers,
Feb. 2001, pp.372-373.
[4]. K. Riepe, “35-40 GHz Monolithic VCO’s utilizing high
speed GaInP/GaAs HBT’s,” in IEEE Microwave and Guide
Wave Letters. vol.4, no.8, Aug. 1994, pp274-276.
[5]. S. Yamahata, “ Ultra-high fmax and fT InP/InGaAs double-
hetrojunction bipolar transistors with step-graded InGaAsP
collector,” in 16th Annual IEEE GaAs IC Sump. Dig.,
Philadelphia. PA, Oct.1994, pp.245-348.
[6]. K. W. Kobayashi, “InP based HBT millimeter-wave
technology and circuit performance to 40GHz,” in IEEE 1993
Microwave and Millimeter-wave Monothic Circuit Symp. Dig.,
Atlanta. GA, June 1993, pp.85-88.
[7]. Ali Hajimiri, “A General Theory of Phase Noise in
Electronical Oscillators,” in IEEE journal of solid-state circuits,
vol.33, No.2 Feb. 1998.
[8]. IBM BiCMOS-6HP Model Reference Guide, pp.3-144.
Fig. 7. The layout for 51.8GHz
Proceedings of The 3rd IEEE International Workshop on System-on-Chip for Real-Time Applications ISBN 0-7695-1929-6/03 $17.00 © 2003 IEEE
[9]. L.Dauphinee,M. Copeland, and P. Schvan, “A balanced
1.5GHz Voltage Controlled oscillator with an integrated LC
resonator,” in Solid State Circuits Conference Digest of
Technical Papers, Feb.1997, pp.390-391.
[10]. J. Craninckx and M.Steyaert, “ A 1.8GHz low phase noise
CMOS VCO using optimized hollow spiral inductors,” in IEEE
J. Solid-State Circuits, vol.32, no.6, May 1997, pp.736-744.
[11]. J. Craninckx, M.Steyaert, and H. Miyakawa, “A fully
integrated spiral LC CMOS VCO set with prescalar for GSM
and DCS-1800 systems, ” in Proc. CICC, May 1997, pp.403-
406.
[12]. T. H.Lee, “OSCILLATOR PHASE NOISE: A
TUTORIAL (Invited),” in IEEE 1999 custom integrated
circuits conference.
[13]. Y. Tsividis . “ Operation and Modeling of The MOS
Transistor,” Second edition, Mcgraw-hill international editions,
Electronical engineering Series, pp.201-202.
[14]. D. Ham, “ Concept and Methods in Optimization of
Integrated LC VCO,” in IEEE journal of solid-state circuits,
vol.36, no.6, Jun. 2001, pp.896-907.
[15]. Jan Craninckx, “Low-Noise Voltage-Controlled Oscillator
Using Enhanced LC-Tanks, ” in IEEE transactions on circuit
and systems – II: analog and digital signal processing, vol.42,
No.12, Dec. 1995.
Proceedings of The 3rd IEEE International Workshop on System-on-Chip for Real-Time Applications ISBN 0-7695-1929-6/03 $17.00 © 2003 IEEE